@Article{SilvaJrRossSilvUeda:2014:AdEnMe,
               author = "Silva Junior, Ata{\'{\i}}de Ribeiro da and Rossi, Jos{\'e} 
                         Osvaldo and Silva Neto, Lauro Paulo da and Ueda, Mario",
          affiliation = "{Instituto Nacional de Pesquisas Espaciais (INPE)} and {Instituto 
                         Nacional de Pesquisas Espaciais (INPE)} and {Instituto Nacional de 
                         Pesquisas Espaciais (INPE)} and {Instituto Nacional de Pesquisas 
                         Espaciais (INPE)}",
                title = "Adherence Enhancement of Metallic Film on PZT-Type Ceramic Using 
                         Nitrogen Plasma Implantation",
              journal = "IEEE Transactions on Plasma Science",
                 year = "2014",
               volume = "42",
               number = "10",
                pages = "3173 - 3179",
                month = "Oct.",
                 note = "{Setores de Atividade: Pesquisa e desenvolvimento 
                         cient{\'{\i}}fico.}",
             keywords = "annealing, ceramics, ion implantation, metallization, plasma 
                         materials processing applications, dielectrics.",
             abstract = "Lead zirconate titanate (PZT)-type ceramics used as piezoelectric 
                         sensors have electrodes made by metallic film deposition on the 
                         ceramic substrate, which has low adherence on substrate surface. 
                         During the welding process in electronic component manufacture, 
                         the metallic film releases from surface due to the electrode 
                         delamination caused by the large difference in thermal expansion 
                         gradients between the film and ceramic. Delamination is a serious 
                         problem found in the manufacture of ceramic capacitors since the 
                         metallic electrode is split into several layers, leading to a 
                         component failure as the electrode is not in contact with the 
                         ceramic surface anymore. Therefore, in order to increase the film 
                         adherence on the ceramic it is proposed in this paper to treat the 
                         PZT samples covered with silver metallic films by means of plasma 
                         immersion ion implantation (PIII) technique using a high voltage 
                         100-kV/1-\μs stacked Blumlein pulser. By using this 
                         technique, it is shown that the mechanical adherence of the 
                         electrode metallic silver film is increased, which allows the 
                         welding process of terminals for the piezoelectric device 
                         manufacture without film release failure. Thermal stress relief 
                         treatment known as annealing process was also used in this paper 
                         as an alternative to the PIII method for increasing the film 
                         anchoring on ceramic substrate.",
                  doi = "10.1109/tps.2014.2314026",
                  url = "http://dx.doi.org/10.1109/tps.2014.2314026",
                 issn = "0093-3813",
                label = "lattes: 3979447098275675 3 SilvaJrRossNetoUeda:2014:AdEnMe",
             language = "en",
           targetfile = "06798728.pdf",
        urlaccessdate = "28 abr. 2024"
}